Inactive

SOURCES SOUGHT NOTICE Department of State, Bureau of Diplomatic Security, Countermeasures, Physical Security Program’s Research and Development Branch (DS/PSD/RD) PURPOSE This is a Sources Sought as o... SOURCES SOUGHT NOTICE Department of State, Bureau of Diplomatic Security, Countermeasures, Physical Security Program’s Research and Development Branch (DS/PSD/RD) PURPOSE This is a Sources Sought as outlined in FAR Part 10. The purpose of this Sources Sought is to accomplish market research pursuant to Federal Acquisition Regulation (FAR) Part 10, and to identify sources capable of providing the items described herein. This notice is issued solely for information and planning purposes and does not constitute a Request for Quote (RFQ) or a commitment on the part of the Government to conduct a solicitation for the requirement described in this notice in the future. Respondents are advised that the Government will not pay for information submitted in response to this Sources Sought, nor will it compensate interested parties for any costs incurred in the development/furnishing of a response. Please note that a decision not to submit a response to this Sources Sought will not preclude a vendor from participating in any future solicitation. The anticipated North American Industry Classification System (NAICS) Code assigned to this procurement is 541330. BACKGROUND The Department’s Bureau of Diplomatic Security, Physical Security Research and Development Branch (DS/PSD/RD) has evidence that the adhesive bonds of glass to PVB (polyvinyl butyral), glass to PC (polycarbonate) and PC to PC degrade over time. The degradation in the case of the glass to PVB adhesion can be caused by moisture migration in the PVB from the edges to the center of the layup. A widely viewed source of the degradation in the adhesive bond related to PC results from differences in the thermal expansion and contraction during thermal cycles. A second view is the inherent stresses in the materials resulting from the lamination process. PSD/RD needs to determine if this loss of adhesion negatively effects the layups’ blast resistant properties and to what degree depending on the percentage of adhesion degradation. DESCRIPTION OF NEED See attached SOW. Response Instructions: Sources who are able to satisfy the requirement as described above are invited to submit information describing their technical approach. Responses must be submitted electronically, limited to 10 pages or less, in Microsoft Word or Adobe Portable Document format (PDF), using Times New Roman, 12-point font, 1 inch margins on all sides, on 8.5 in x 11 in paper. The Government will not entertain telephone calls for this Sources Sought. The responses should include the following information: Company name, physical or mailing address, and telephone number GSA FSS contract number, if applicable Company point of contact name, title, email address, and telephone number DUNS Number Small business and socio-economic size-status. All interested companies must have an active registration in the System for Award Management (SAM) and not be on the Excluded Party List. Define capabilities and resources available and provide one or more examples of successful testing of this type that your company has done in the past. To aid the Government, please segregate proprietary information. Please be advised that all submissions become Government property and will not be returned. The deadline for submitting responses to the Sources Sought Notice is July 20, 2021 at 01:00 PM Eastern Time, and shall be submitted to Sara Marron, contract specialist, via email at MarronSM2@state.gov. Please include “19AQMM21N0061 - Effects of Delamination on Blast Resistance Widows" in the "subject" line. Sales brochures, videos and other marketing information materials shall not be accepted. Telephone inquiries will not be accepted or acknowledged. QUESTIONS Questions regarding this announcement shall be submitted in writing by e-mail to Sara Marron at MarronSM2@state.gov no later than July 12, 2021 at 01:00 PM Eastern Time.