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This technical specification is for the surface preperation of the copper conductor that will be used in the manufacturing of the new Ohmic Heating (OH) solenoid for the new TF-OH bundle for the Natio... This technical specification is for the surface preperation of the copper conductor that will be used in the manufacturing of the new Ohmic Heating (OH) solenoid for the new TF-OH bundle for the National Spherical Torus Experiment Upgrade (NSTX-U). The perparation of the conductor surface in the manner described in this document provides for greater bonding strength between the copper surface and the resins that are used to impregnate the fiberglass insulation that is applied to copper conductor during fabrication of the TF-OH bundle. The preparation of the conductor surface consists of three main operations: 1.) Meida-blasting the conductor surface to remove oxides. 2.) Priming, which seals the surface, preventin oxide formation, and provides a high-strength bond to the resins used during impregnation of the fiberglass. 3.) Oven curing of the primer It is imperative that the freshly sandblased copper surface be protected against oxide formation prior to application of the primer. The workscopes are detailed on the Draft Statement of Work (SOW) attached to the RFI.