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Sources Sought for the following: BSA is looking for metallized fused silica on both the top and bottom side. The attached GDS file shows the top and bottom patterns. The minimum pattern feature size ... Sources Sought for the following: BSA is looking for metallized fused silica on both the top and bottom side. The attached GDS file shows the top and bottom patterns. The minimum pattern feature size should be 0.15 mm. The metallization stack can be chosen by the offeror,but should be approved by BSA, combinations of Ti, Cu, Au are preferred, and the total metal thickness should be at least 3 um, the thicker the better. BSA is looking for deposited thin film metal, not thick film. Part of the sample validation process will be making sure we can solder and wirebond to the metal on the fused silica without issue. The offeror should be able to drill holes 1-2 mm in diameter in the fused silica and metallize them so they are conductive from top to bottom. The sample is a 70mm sided square, the offeror should be able to dice it from a 100 mm wafer. Larger wafer sizes are welcome. The thickness of the fused silica should be 0.5mm to 1mm, preferably on the higher side of that bound. The offeror should propose which fused silica they prefer working with and provide me with the properties, specifically the dielectric constant. Once a thickness is decided on, and I have the dielectric constant, the metallization pattern will be adjusted, as the purpose of this sample is to determine parameters for controlled differential impedance on fused silica. If this sample and the validation test is successful it will be needed by June 1, 2021, the next order will be for approximately 30 more (10 parts each for 3 different designs) - top and bottom metallization and conductive through hole vias. If larger wafer sizes are available, we may look for up to 12cm x 8 cm substrates. The second order would be needed by August 1st, 2021.