The Army Research Laboratory (ARL), Sensors and Electron Devices Directorate (SEDD), requires photonic integrated circuits (PICs) with an 800 nanometer (nm) thick silicon nitride device layer.
COMBO SYNOPSIS SOLICITATION FOR COMMERCIAL ITEMS 1. Class Code: 36 2. NAICS Code: 334413 3. Subject: The Army Research Laboratory (ARL), Sensors and Electron Devices Directorate (SEDD), requires photo... COMBO SYNOPSIS SOLICITATION FOR COMMERCIAL ITEMS 1. Class Code: 36 2. NAICS Code: 334413 3. Subject: The Army Research Laboratory (ARL), Sensors and Electron Devices Directorate (SEDD), requires photonic integrated circuits (PICs) with an 800 nanometer (nm) thick silicon nitride device layer. 4. Solicitation Number: W911QX21Q0188 5. Set-Aside Code: N/A 6. Response Date: Five (5) business days after solicitation posting 7. Place of Delivery/Performance: U.S. Army Research Laboratory 2800 Powder Mill Road Adelphi, MD 20783 United States 8. (i) This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. INTENT TO SOLICIT ONLY ONE SOURCE The proposed contract action is for supplies or services for which the Government is soliciting and negotiating with only one source under the authority of FAR 13.106-1(b) (1)(i) “Only One Responsible Source and No Other Supplies or Services Will Satisfy Agency Requirements.” The name of the company the Government intends to award a contract to is LiGenTec SA, Bâtiment L, Chemin De La Dent D'oche 1B, Ecublens, 1024, Switzerland. This notice of intent is not a request for competitive proposals. However, the Government will consider all proposals received prior to the closing date and time of this solicitation. (ii) The solicitation number is W911QX21Q0188. This acquisition is issued as a Request for Quote (RFQ). (iii) The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2021-06. (iv) The associated NAICS code is 334413. The small business size standard is 1,250 emplyees. (v) The following is a list of contract line item number(s) (CLIN) and items, quantities and units of measure, (including option(s), if applicable): CLIN 0001 (RUN 1) QUANTITY: ONE (1) UNIT OF ISSUE: JOB CLIN 0002 (RUN 2) QUANTITY: ONE (1) UNIT OF ISSUE: JOB CLIN 0003 (RUN 3) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0004 (RUN 3) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0005 (RUN 3) QUANTITY: ONE (1) UNIT OF ISSUE: JOB CLIN 0006 (RUN 4) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0007 (RUN 4) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0008 (RUN 4) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Optional CLIN 0009 (RUN 5) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0010 (RUN 5) QUANTITY: ONE (1) UNIT OF ISSUE: JOB Option CLIN 0011 (RUN 5) QUANTITY: ONE (1) UNIT OF ISSUE: JOB (vi) Description of requirements: C.2.1 RUN 1: One set of seven identical die fabricated according to ARL’s designs, subject to the following requirements: The contractor shall deliver the latest Process Development Kit (PDK) to ARL in advance of the tape-out date listed on the contractor’s website. The contractor shall accept from ARL a GDSII stream format file (GDS file). The GDS file shall specify the exact design of a PIC The area allotted to ARL for the design of the PIC shall encompass at least a 5 millimeter (mm) by 10 mm rectangle. The contractor shall fabricate the Photonic Integrated Circuits (PICs) according to the design specified in the GDS file provided by ARL, thereby producing a number of die. The fabricated die shall include an 800-nanometer (nm) thick layer of silicon nitride (Si3N4), surrounded by at least 2 micrometers of silicon dioxide (SiO2) above the Si3N4 layer and at least 2 micrometers of SiO2 below the Si3N4 layer, matching the specifications of the X1 Module described in the PDK and patterned according to the GDS file. The fabricated die shall have facets etched according to the specifications of the AFD Module described in the PDK and patterned according to the GDS file. The fabricated die shall include an advanced metal (P1) layer matching the specifications of the P1 Module described in the PDK and patterned according to the GDS file. The contractor shall deliver to ARL at least seven (7) “known-good” die. For the “known-good” die delivered to ARL, the performance of any elements specified within the PDK shall match the specifications outlined therein. The contractor shall make best effort to deliver the “known-good” copies of the PIC to ARL within 24 weeks of the tape-out date listed on the contractor’s website. C.2.2 RUN 2: One set of seven identical die fabricated according to ARL’s designs, subject to the following requirements: The contractor shall deliver the latest PDK to ARL in advance of the tape-out date listed on the contractor’s website. The contractor shall accept from ARL a GDSII stream format file (GDS file). The GDS file shall specify the exact design of a PIC The area allotted to ARL for the design of the PIC shall encompass at least a 5 millimeter (mm) by 10 mm rectangle. The contractor shall fabricate the PIC according to the design specified in the GDS file provided by ARL, thereby producing a number of die. The fabricated die shall include an 800-nanometer (nm) thick layer of silicon nitride (Si3N4), matching the specifications of the X1 Module described in the PDK and patterned according to the GDS file. The fabricated die shall have facets etched according to the specifications of the AFD Module described in the PDK and patterned according to the GDS file. The fabricated die shall include an advanced metal (P1) layer matching the specifications of the P1 Module described in the PDK and patterned according to the GDS file. The contractor shall deliver to ARL at least seven (7) “known-good” die. For the “known-good” die delivered to ARL, the performance of any elements specified within the PDK shall match the specifications outlined therein. The contractor shall make best effort to deliver the “known-good” copies of the PIC to ARL within 24 weeks of the tape-out date listed on the contractor’s website. C.2.3 RUN 3: One set of seven identical die fabricated according to ARL’s designs, subject to the following requirements: The contractor shall deliver the latest PDK to ARL in advance of the tape-out date listed on the contractor’s website. The contractor shall accept from ARL a GDSII stream format file (GDS file). The GDS file shall specify the exact design of a PIC The area allotted to ARL for the design of the PIC shall encompass at least a 5 millimeter (mm) by 10 mm rectangle. The contractor shall fabricate the PIC according to the design specified in the GDS file provided by ARL, thereby producing a number of die. The fabricated die shall include an 800-nanometer (nm) thick layer of silicon nitride (Si3N4), matching the specifications of the X1 Module described in the PDK and patterned according to the GDS file. The fabricated die shall have facets etched according to the specifications of the AFD Module described in the PDK and patterned according to the GDS file. The fabricated die shall include an advanced metal (P1) layer matching the specifications of the P1 Module described in the PDK and patterned according to the GDS file. The contractor shall deliver to ARL at least seven (7) “known-good” die. For the “known-good” die delivered to ARL, the performance of any elements specified within the PDK shall match the specifications outlined therein. The contractor shall make best effort to deliver the “known-good” copies of the PIC to ARL within 24 weeks of the tape-out date listed on the contractor’s website. Optionally, in Run 3, the contractor shall replace the AFD Module with module for making U-grooves at the chip facet, fabricated according to the specifications of the UG Module described in the PDK. Optionally, in Run 3, the contractor shall include a module to enable coupling between a waveguide in the X1 layer and a standard single mode optical fiber with a 10 micrometer core, fabricated according to the specifications of the ExSpot Module described in the PDK. C.2.4 RUN 4: One set of seven identical die fabricated according to ARL’s designs, subject to the following requirements:: The contractor shall deliver the latest PDK to ARL in advance of the tape-out date listed on the contractor’s website. The contractor shall accept from ARL a GDSII stream format file (GDS file). The GDS file shall specify the exact design of a PIC The area allotted to ARL for the design of the PIC shall encompass at least a 5 millimeter (mm) by 10 mm rectangle. The contractor shall fabricate the PIC according to the design specified in the GDS file provided by ARL, thereby producing a number of die. The fabricated die shall include an 800-nanometer (nm) thick layer of silicon nitride (Si3N4), matching the specifications of the X1 Module described in the PDK and patterned according to the GDS file. The fabricated die shall have facets etched according to the specifications of the AFD Module described in the PDK and patterned according to the GDS file. The fabricated die shall include an advanced metal (P1) layer matching the specifications of the P1 Module described in the PDK and patterned according to the GDS file. The contractor shall deliver to ARL at least seven (7) “known-good” die. For the “known-good” die delivered to ARL, the performance of any elements specified within the PDK shall match the specifications outlined therein. The contractor shall make best effort to deliver the “known-good” copies of the PIC to ARL within 24 weeks of the tape-out date listed on the contractor’s website. Optionally, in Run 4, the contractor shall replace the AFD Module with module for making U-grooves at the chip facet, fabricated according to the specifications of the UG Module described in the PDK. Optionally, in Run 4, the contractor shall include a module to enable coupling between a waveguide in the X1 layer and a standard single mode optical fiber with a 10 micrometer core, fabricated according to the specifications of the ExSpot Module described in the PDK. C.2.5 Optional RUN 5: One set of seven identical die fabricated according to ARL’s designs, subject to the following requirements: The contractor shall deliver the latest PDK to ARL in advance of the tape-out date listed on the contractor’s website. The contractor shall accept from ARL a GDSII stream format file (GDS file). The GDS file shall specify the exact design of a PIC The area allotted to ARL for the design of the PIC shall encompass at least a 5 millimeter (mm) by 10 mm rectangle. The contractor shall fabricate the PIC according to the design specified in the GDS file provided by ARL, thereby producing a number of die. The fabricated die shall include an 800-nanometer (nm) thick layer of silicon nitride (Si3N4), matching the specifications of the X1 Module described in the PDK and patterned according to the GDS file. The fabricated die shall have facets etched according to the specifications of the AFD Module described in the PDK and patterned according to the GDS file. The fabricated die shall include an advanced metal (P1) layer matching the specifications of the P1 Module described in the PDK and patterned according to the GDS file. The contractor shall deliver to ARL at least seven (7) “known-good” die. For the “known-good” die delivered to ARL, the performance of any elements specified within the PDK shall match the specifications outlined therein. The contractor shall make best effort to deliver the “known-good” copies of the PIC to ARL within 24 weeks of the tape-out date listed on the contractor’s website. Optionally, in Run 5, the contractor shall replace the AFD Module with module for making U-grooves at the chip facet, fabricated according to the specifications of the UG Module described in the PDK. Optionally, in Run 5, the contractor shall include a module to enable coupling between a waveguide in the X1 layer and a standard single mode optical fiber with a 10 micrometer core, fabricated according to the specifications of the ExSpot Module described in the PDK. Note: ARL will order the runs in sequence, while using information from previous runs to inform the design of following runs. The contractor shall be paid for each run individually, when it is delivered. (vii) Delivery is required by 24 months after contract award (ACA). Delivery shall be made to Army Research Laboratory (ARL), Adelphi, MD, 20783 Acceptance shall be performed at ARL, 4 Adelphi, MD, 20783.The FOB point is Destination. (viii) The provision at 52.212-1, Instructions to Offerors – Commercial, applies to this acquisition. The following addenda have been attached to this provision: NONE. (ix) Offerors shall include a completed copy of the provision at FAR 52.212-3 (with its Alternate I), Offeror Representations with its offer. (x) The clause at 52.212-4, Contract Terms and Conditions - Commercial Items, applies to this acquisition. The following addenda have been attached to this clause NONE. (xi) The clause at 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders - Commercial Items and the selected clauses listed in DFARS 212.301 Solicitation provisions and Contract Clauses for the Acquisition of Commercial Items (see attachment for these selections), applies to this acquisition. The following additional FAR/DFARS clauses cited in this clause are applicable: 52.204-10 REPORTING EXECUTIVE COMPENSATION AND FIRST-TIER SUBCONTRACT AWARDS (OCT 2018) 52.209-6 PROTECTING THE GOVERNMENT’S INTEREST WHEN SUBCONTRACTING WITH CONTRACTORS DEBARRED, SUSPENDED, OR PROPOSED FOR DEBARMENT (OCT 2015) 52.219-28, POST-AWARD SMALL BUSINESS PROGRAM REREPRESENTATION (MAY 2020) 52.222-3, CONVICT LABOR (JUN 2003) 52.222-19 DEVIATION 2020-O0019, CHILD LABOR--COOPERATION WITH AUTHORITIES AND REMEDIES (JAN 2020) 52.222-21, PROHIBITION OF SEGREGATED FACILITIES (APR 2015) 52.222-26, EQUAL OPPORTUNITY (SEP 2016) 52.222-36, AFFIRMATIVE ACTION FOR WORKERS WITH DISABILITIES (JUL 2014) 52.222-50, COMBATING TRAFFICKING IN PERSONS (OCT 2020) 52.223-18, ENCOURAGING CONTRACTOR POLICIES TO BAN TEXT MESSAGING WHILE DRIVING (AUG 2011) 52.225-13, RESTRICTIONS ON CERTAIN FOREIGN PURCHASES (JUN 2008) 52.232-33, PAYMENT BY ELECTRONIC FUNDS TRANSFER—CENTRAL CONTRACTOR REGISTRATION (OCT 2018) 52.232-36, PAYMENT BY THIRD PARTY (MAY 2014) (xii) The following additional contract requirement(s) or terms and conditions apply (full text of all FAR/DFARS clauses that contain fill-in information, as well as all local clauses, can be found in the attached Provisions and Clauses Full-Text document): FAR CLAUSES 52.204-7, SYSTEM FOR AWARD MANAGEMENT (OCT 2018) 52.204-13, SYSTEM FOR AWARD MANAGEMENT MAINTENANCE (OCT 2018) 52.204-16, COMMERCIAL AND GOVERNMENT ENTITY CODE REPORTING (AUG 2020) 52.204-18, COMMERCIAL AND GOVERNMENT ENTITY CODE MAINTENANCE (AUG 2020) 52.204-24, REPRESENTATION REGARDING CERTAIN TELECOMMUNICATIONS AND VIDEO SURVEILLANCE SERVICES OR EQUIPMENT (OCT 2020) 52.232-40, PROVIDING ACCELERATED PAYMENTS TO SMALL BUSINESS SUBCONTRACTORS (DEC 2013) 52.252-1, PROVISIONS INCORPORATED BY REFERENCE (FEB 1998) 52.252-2, CLAUSES INCORPORATED BY REFERENCE (FEB 1998) DFARS CLAUSES 252.203-7000, REQUIREMENTS RELATING TO COMPENSATION OF FORMER DOD OFFICIALS (SEP 2011) 252.204-7000, DISCLOSURE OF INFORMATION (OCT 2016) 252.211-7003, ITEM IDENTIFICATION AND VALUATION (JUN 2013) 252.232-7003, ELECTRONIC SUBMISSION OF PAYMENT REQUESTS AND RECEIVING REPORTS (JUN 2012) 252.232-7006, WIDE AREA WORKFLOW PAYMENT INSTRUCTIONS (DEC 2018) LOCAL CLAUSES ACC – APG POINT OF CONTACT TECHNICAL POINT OF CONTACT TYPE OF CONTRACT GOV INSPECTION AND ACCEPTANCE EXERCISE OF OPTION PAYMENT OFFICE (BANKCARD) TAX EXEMPTION CERT. (ARL) PAYMENT INSTRUCTIONS RECEIVING ROOM – ALC DFARS COMMERCIAL CLAUSES ADELPHI CONTR. DIVISION URL PAYMENT TERMS EXCEPTIONS IN PROPOSAL AWARD OF CONTRACT FOREIGN NATIONALS PERFORMING (xiii) This acquisition is rated under the Defense Priorities and Allocations System (DPAS) as N/A (xiv) The following notes apply to this announcement: In accordance with FAR 32.003, contract financing cannot be provided for this acquisition. (xv) Offers are due five (5) business days after solicitation posting, by 11:59 AM EST, at swati.jain2.civ@mail.mil. (xvi) For information regarding this solicitation, please contact swati.jain2.civ@mail.mil, Phone: 301-394-0045.
Data sourced from SAM.gov.
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