Inactive 8(a) Sole Source (FAR 19.8)

The Army Research Laboratory requires a set of wire bonders with the following characteristics. The heavy wire bonder shall meet the following minimum requirements: Produce wedge-wedge heavy wire bond... The Army Research Laboratory requires a set of wire bonders with the following characteristics. The heavy wire bonder shall meet the following minimum requirements: Produce wedge-wedge heavy wire bonds Process aluminum from 200 to 500 micrometer Feature both manual and semi-automatic modes to reduce training requirements of technicians and engineers Semi-automatic mode will include a programmable y-axis and z-axis Feature a color-display with with settings able to be saved to an internal harddrive Include pull tester for bond head with force range 200 - 1000 grams Have an adjustable bondforce from 500 to 1800 centinewton Have options for ribbon bonding Workbench/table-top form factor Compatible with 120 V, 60 Hz power Include shipping, starter wire sets, and technician installation The gold ball bonder shall meet the following minimum requirements: Produce ball-wedge loop wire bonds Process au wires from 17.5 to 50 micrometer Capable of copper wire bonding Feature both manual and semi-automatic modes to reduce training requirements of technicians and engineers Semi-automatic mode will include a programmable z-axis Include ball, wedge, bump, stitch and ribbon modes, with stitch being programmable in semi-automatic mode, on one bond head Feature a color-display with with settings able to be saved to an internal harddrive Include pull tester for bond head with force range up to 30 grams Have options for ribbon bonding Feature a digitally controlled heated stage Have an adjustable bondforce from 15 to 150 centinewton and programmable frequencies/times Workbench/table-top form factor Step precision of 1 micrometer, industry standard Feature a digitally controlled heated stage Compatible with 120 V, 60 Hz power Include shipping, starter wire sets, and technician installation