This opportunity supports the U.S. Army’s 3GEN FLIR program to enhance reconnaissance, surveillance, and target acquisition through improved thermal imaging technology. The contract focuses on ground-based platforms during the B-Kit Production and Deployment phase. It is a hybrid contract combining Firm-Fixed-Price (FFP) for hardware production and Cost-Plus-Fixed-Fee (CPFF) for technical, engineering, test, and logistics services. No specific budget amounts, performance location, or submission timelines are mentioned in the description. The program aims to maximize component commonality to reduce lifecycle costs.