J&A - Direct Bonding

Notice ID:W56KGU26CA004

Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.

Department/Ind.Agency Subtier Office
DEPT OF DEFENSE DEPT OF THE ARMY W6QK ACC-APG
NAICS Not provided
  PSC   AC13 R&D- DEFENSE SYSTEM: AIRCRAFT (ADVANCED DEVELOPMENT)
LOCATION: Not Given
Primary Contact
Hanh Dinh
h*************v@army.mil
Not Given

Links (0)

Attachments (1)

Document
Size
Access
Updated
A02 - JA - Direct Bonding - Redacted.pdf
147.48 KB
Public
May 27, 2026


Data sourced from SAM.gov. View Official Posting »

Notification