CALL 1 – SECURE ENCLAVE CHIPLETS_Amendment 2
The Department of War is seeking innovative chiplet designs for secure, state-of-the-art microelectronics under the Secure Enclave program, focusing on high-demand mission areas like RF/EW, munitions, security, and autonomy. White papers are due by 5:00 PM ET on July 27, 2026, with questions accepted until July 15, 2026. The government targets a 12-month period of performance, though offerors may propose alternatives. No specific budget amount is provided, and the location for performance is not specified, though classified work must occur at the offeror’s facility. This two-step solicitation requires a white paper submission before a potential invitation for a full proposal.