Die Bonding and Vacuum Packaging System

Notice ID:N0017326QKN05

Please see attached combined synopsis/solicitation

Department/Ind.Agency Subtier Office
DEPT OF DEFENSE DEPT OF THE NAVY NAVAL RESEARCH LABORATORY
NAICS 333993 - Packaging Machinery Manufacturing
  PSC   3540 WRAPPING AND PACKAGING MACHINERY
LOCATION: Not Given
Primary Contact
KEVIN NGUYEN
k***************v@us.navy.mil
Not Given
Alt Contact
Jamie Dixon
j****************v@us.navy.mil
Not Given

Links (0)

Attachments (2)

Document
Size
Access
Updated
Specifications - Die Bonding.pdf
175.88 KB
Public
Jul 23, 2026
CSS N0017326QKN05 Die Bonding and Packaging.pdf
118.04 KB
Public
Jul 23, 2026


Data sourced from SAM.gov. View Official Posting »

Notification