Inactive
Notice ID:HQ072723R0009
MEA is seeking the acquisition of a new Wire Bonder to complete Microcircuit Assembly (MCA) projects within DMEA. The KnS Wire Bonder RAPID Pro allows operators to wire bond die to package, establishi...
MEA is seeking the acquisition of a new Wire Bonder to complete Microcircuit Assembly (MCA) projects within DMEA. The KnS Wire Bonder RAPID Pro allows operators to wire bond die to package, establishing continuity to the desired die circuitry.