Inactive

The purpose of this acquisition is to procure custom DMEA Rhinestone circuit design overmolded multi-chip module (MCM) devices, in a Ball Grid Array (BGA) or Quad-Flat No-Lead (QFN) configuration. See... The purpose of this acquisition is to procure custom DMEA Rhinestone circuit design overmolded multi-chip module (MCM) devices, in a Ball Grid Array (BGA) or Quad-Flat No-Lead (QFN) configuration. See attached combined synopsis/solicitation and Statement of Work.