Besi/Datacon Die Bonder Flip Chip

Inactive
Notice ID:HQ072719S0001

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Department/Ind.Agency Subtier Office
DEPT OF DEFENSE DEFENSE MICROELECTRONICS ACTIVITY (DMEA) DEFENSE MICROELECTRONICS ACTIVITY
NAICS 334413 - Semiconductor and Related Device Manufacturing
  PSC   ELECTRICAL/ELECTRONIC EQPT COMPNTS
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Notification