Inactive

***The submission date for responses is extended through 6 February 2026 by 1700 (5:00pm) EST THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low si... ***The submission date for responses is extended through 6 February 2026 by 1700 (5:00pm) EST THIS IS A REQUEST FOR INFORMATION (RFI) ONLY to identify microelectronic materials that can provide low size, weight, power, and cost. The information provided in the RFI is subject to change and is not binding on the Government. The Defense Threat Reduction Agency has not made a commitment to procure any of the items discussed, and release of this RFI should not be construed as such a commitment or as authorization to incur cost for which reimbursement would be required or sought. All submissions become Government property and will not be returned. Respondents shall provide a brief description on how they plan to develop or advance existing technologies/sensing materials for the identified applications as well as any anticipated technical parameters of their product (or conceptual product). Validation can include historical, literature data or relationship with current DOD researchers. Validation can also include investment from interagency past programs. The Defense Threat Reduction Agency, Research and Development, Chemical and Biological Technologies directorate (DTRA RD-CB) in support of the Joint Program Executive Office for Chemical, Biological, Radiological, Nuclear Defense (JPEO-CBRND) is seeking information on innovative fusion of diverse components for high-performing microelectronics. The goal is to develop hybrid materials and semiconductors to reduce size, weight, power, and cost (SWaP-C) for microelectronics that will revolutionize sensor design and add value on high performance and functionality. The development of these components will feed into technologies that will provide rapid response times as well as reduce the burden to the General Forces by lowering the SWaP-C. ***For details and full RFI, please see the attachment associated with this announcement***