Inactive

If requesting access to the technical data package (TDP), please email RICHARD.MAYNARD.5@US.AF.MIL with a current copy of your DD2345, and JCP printout after requesting access in beta.sam.gov. NOUN: C... If requesting access to the technical data package (TDP), please email RICHARD.MAYNARD.5@US.AF.MIL with a current copy of your DD2345, and JCP printout after requesting access in beta.sam.gov. NOUN: Circuit Card Assembly (CCA), Substrate Fit Mux DESCRIPTION: CCA is a part in MLPRF used in APG-68 Rad ***RESTRICTED TO PREQUALIFIED SOURCES*** Qualification Requirements: See FAR Part 52.209-1 The requirements of FAR 9.202(a) apply. Sources must be qualified prior to being considered for award. Interested vendors that have not been previously approved for this acquisition must submit a Source Approval Request (SAR) package to the Source Development Small Business Office or the Contracting Officer. As prescribed in FAR 9.202(e), the contracting officer need not delay a proposed award in order to provide a potential offeror with an opportunity to demonstrate its ability to meet the standards specified for qualification in the attached Manufacturing Qualification Requirements.