The National Institute of Standards and Technology (NIST) is seeking a universal SiC closed fixture for a SUSS Gen2 Wafer Bonder to enable atomic bonding of substrates. The fixture must be new, support substrates from 10 mm to at least 150 mm, and handle bonding processes including thermocompression, eutectic, adhesion, anodic, and fusion bonds. It must withstand temperatures up to 550°C, overpressure of at least 2 bar, and vacuum of 5.0 x 10E-5 mbar or lower. Performance of services, including installation and acceptance, will take place at the NIST CNST NanoFab cleanroom in Gaithersburg, MD. No budget amount or submission timeline is specified in this sources sought notice.