The National Institute of Standards and Technology (NIST) is conducting a sources sought notice for a TPT manual wire bonder capable of wedge, ball, and ribbon bonding with specific technical specifications. The wire bonder must support gold and aluminum wire diameters from 17 µm to 75 µm, ribbon widths up to 250 µm, and include features like a motorized clamp, temperature controller up to 250°C, and a tabletop size under 600 x 600 x 300 mm. No budget amount is specified in the notice. The location for performance is not mentioned. Responses should be submitted as soon as possible, with questions due by 12:00 PM Eastern Time on June 18, 2026.