Low-temperature Printed Circuit Board (PCB)
This is a Sources Sought Notice ONLY. Requests for copies of a solicitation will not receive a response. This Notice is for planning purposes only and is not a Request for Proposal or Request for Quot... This is a Sources Sought Notice ONLY. Requests for copies of a solicitation will not receive a response. This Notice is for planning purposes only and is not a Request for Proposal or Request for Quotation or an obligation on the part of the NIST for conducting a follow-on acquisition. NIST does not intend to award a contract on the basis of this Notice, or otherwise pay for the information requested. No entitlement or payment of direct or indirect costs or charges by NIST will arise as a result of submission of responses to this Notice and NIST's use of such information. NIST recognizes that proprietary components, interfaces and equipment, and clearly mark restricted or proprietary components, interfaces and equipment, and clearly mark restricted or proprietary data and present it as an addendum to the non-restricted/non-proprietary information. In the absence of such identification, NIST will assume to have unlimited rights to all technical data provided in the response. NO SOLICITATION DOCUMENTS EXIST AT THIS TIME. NIST is seeking information from small businesses that are capable of providing one (1) motherboard low-temperature printed circuit board (PCB) and 50 daughter low-temperature PCBs Summary of Requirements: The requested equipment shall include but is not limited to the minimum specifications below. The potential offeror shall provide information demonstrating that the small business entity is able to provide one (1) motherboard low-temperature PCB and 50 daughter low-temperature PCBs that meets the following minimum specifications: 1. PCB construction: The PCB will consist of two separate boards which mate together: 1) A "mother board" where elements such as the DC connectors, bias tees, high frequency connectors, and RC filters reside; 2) A "daughter board" which mates to the motherboard for electrical connections and where the chip with the device of interest can be mounted. 2. Die size: The PCB daughter board will accommodate a 1 cm x 1 cm silicon chip. Connection to the chip will be made by wirebonding. a. PCB size: Overall size of PCB with mounting bracket should be less than the He-3 fridges available space at a manget bore (~1.75 inches) so that it can be properly mounted on to cold finger. In addition to above, the motherboard (with proper interposers for connection to daughter board) and daughterboard (preferable to have non-magnetic plating). 3. Wiring: a. There must be low-frequency (<1 kHz) and high frequency (1 GHz) lines capable of making it onto the chip. i. There must be a separate connector for these lines to enable electrostatic discharge damage mitigation by connection to ground when the sample is being loaded into the cryostat. ii. The low frequency lines shall be connectorized on the mother board with nanoD connectors. Custom/commercial jumper cable shall be provided for making connection between nanoD to female micro-D non-magnetic connector for maximum 50 cm length. iii. The low-frequency lines shall be RC filtered with components on the motherboard with a 3 dB point of 100 kHz or below. iv. There must be at least 5 high frequency lines capable of making it onto the chip. v. High frequency lines must be launched on the mother board PCB with mini coax connectors. vi. High frequency lines must have "bias tees" which allow application of a DC voltage and a high frequency voltage. vii. High frequency lines must transmit voltages at 1 GHz with transmission better than -3 dB onto the chip through a short wire bond. viii. After award and government consultation, the contractor shall supply high frequency cabling of the appropriate length. ix. The daughter board shall contain places for chip mounted components to be installed to use, for example, LC-resonant circuits. x. The layout and design of the wiring on the PCB shall not be supplied by the government. 4. Cryostat compatibility: a. High magnetic field compatibility: All pcb components must be compatible with high magnetic fields up to at least 2 tesla. b. Low-temperature compatibility: All pcb components must be compatible with low-temperatures (< 100 mK). c. The PCB must come with thermalizing mounting brackets which mate with bottom-loading fast-sample exchange mechanisms. The thermalizing mounting bracket shall be compatible with the available space in the magnet bore(1.75 inches) of He-3 300 mK fridge. These brackets should allow operation in perpendicular or parallel magnetic field when the field is applied with a superconducting solenoid. NIST is seeking responses from all responsible small business sources Small businesses are defined under the size standard of 500 employees associated with the applicable NAICS code, 333249 - Other Industrial Machinery Manufacturing. Please include company's size classification and socio-economic status in any response to this notice. Interested parties shall describe the capabilities of their organization as it relates to the requirements described herein. Small businesses able to provide the requested equipment are directed to email a detailed response describing their capabilities to tracy.bisson@nist.gov no later than the response date for this source sought notice. The report should include any information relevant to the organization's capabilities to meet the requirements detailed in Summary of Requirements. Also, the following information is requested to be provided as part of the response to this sources sought notice: 1. Name of company/companies that are authorized provide product, their addresses, and a point of contact for the company (name, phone number, fax number and email address). 3. Number of days, after receipt of order that is typical for delivery of product. 4. Indication of whether the product is currently on one or more GSA Federal Supply Schedule contracts or any other government-wide contracts. If so, please provide the applicable contract number(s). 5. Indication of whether the product proposed is a commercial item currently offered in the market place. 6. Interested vendors shall address their capability of providing Original Equipment Manufacturer (OEM) parts. 7. Any other relevant information that is not listed above which the Government should consider in developing its minimum performance requirements. Responses are limited to a total of twelve (12) pages in MS Word or PDF format. NIST invites all interested small businesses to submit any questions or comments regarding the Draft Summary of Requirements via email to tracy.bisson@nist.gov within 3 calendar days of the posting of this notice. NIST intends to then post an amendment providing responses to any questions received. Official responses to the Sources Sought Notice shall be submitted by August 19,2019 at 11:59 pm EST. Points of Contact: Tracy Retterer, Contract Specialist, Phone (301) 975-8448, Email: tracy.bisson@nist.gov
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