Inactive Total Small Business Set-Aside (FAR 19.5)

AMENDMENT I: The purpose of this amendment is to address vendor questions that were received prior to the closing of the RFQ. Questions/Answers: 1. Can a remote plasma cleaner head be a vacuum plasma ... AMENDMENT I: The purpose of this amendment is to address vendor questions that were received prior to the closing of the RFQ. Questions/Answers: 1. Can a remote plasma cleaner head be a vacuum plasma chamber with electrodes to generate plasma? The “Remote Plasma Cleaner Head” shall generate a plasma for in-situ cleaning of one particular in-vacuum mirror contained within its own high-vacuum chamber. This mirror transmits extreme ultraviolet light (EUV) through high-vacuum chambers and absorbs infrared (IR) light, and IR light yields carbonization onto the mirror over time. By having the remote plasma head mounted to the mirror’s vacuum chamber, the transmitted EUV flux can be increased by cleaning without bringing the system to atmospheric pressure and without disturbing the alignment of this critical mirror, both of which are in the best interests of research efficiency. To answer the question directly, any remote plasma cleaner head for in-situ cleaning described as described above must be compatible with the high vacuum chamber it attaches to (i.e., when not actively cleaning the mirror with plasma), implying that the Head may be described as a “vacuum plasma chamber.” Although a customized vacuum plasma chamber containing electrodes to generate plasma might satisfy the technical specifications, the Minimum Requirements state that “Experimental, prototype, or custom items will not be considered.“ 2. What is the minimum dimension requirement of the chamber? No minimum dimensional requirement exists on the size of the Remote Plasma Cleaner Head other than having a KF-40 or equivalent port. 3. What are the maximum dimensions of the samples for plasma treatments? There is but one sample intended for plasma treatments, a particular in-vacuum mirror within the EUV HHG high-vacuum beamline. The KF-40 port specification implies coverage over approximately a 1.5-inch diameter circular area in the line-of-sight of the Head. This can be treated as an upper bound, as the cross-sectional area of the EUV flux at the mirror is smaller. The due date/time for quotations has also been extended to July 18, 2024 at 11 am EST. All other solicitation terms and conditions remain unchanged. The National Institute of Standards and Technology’s (NIST) Nanoscale Device Characterization Division has need for a high-vacuum compatible plasma cleaner. It will be installed onto the already procured extreme ultraviolet (EUV) high-harmonic generation (HHG) laser source. The process of HHG leaves carbon deposits on mirrors within the laser source that reduce flux downstream over time. The objective of the plasma cleaner is to remove this buildup from the HHG to ensure the maximum available flux of these EUV photons. This is in direct support of the “EUV Scatterometry” Project under Grand Challenge 2, “Advanced Metrology for Future Microelectronics Manufacturing,” for NIST’s CHIPS Research & Develop Metrology. Semiconductor manufacturing requires optics to sample across 300 mm diameter wafers. Visible and ultraviolet wavelengths are used today, but with the onset of highly complex geometries and materials these wavelengths may be insufficient. To address the need for non-destructive optics-based metrology at shorter wavelengths, NIST is developing a novel measurement science approach in the vacuum and extreme ultraviolet as a new metrology that should prove critical to production methods in chip manufacturing. This CHIPS R&D Metrology Project requires this instrumentation to maximize the EUV intensity in the laboratory using the HHG. Contractor shall supply (1) Plasma cleaner system that is compatible with a high-vacuum chamber, inclusive of FOB Destination shipping and warranty. See attachments for the complete notice details