Amendment 1 to Automatic Wire Bonder

Total Small Business Set-Aside (FAR 19.5)
Notice ID:1333ND26QNB030043

The National Institute of Standards and Technology (NIST) requires a wire bonder to bond a 1 cm² chip inside a 256-pin double-tiered ceramic package. The ceramic package must be affixed to the bonder's stage, and the tool must include a scope for inspection and a method to secure the sample. The goal is to streamline this bonding process.

Department/Ind.Agency Subtier Office
COMMERCE, DEPARTMENT OF NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY DEPT OF COMMERCE NIST
NAICS 333242 - Semiconductor Machinery Manufacturing
  PSC   LABORATORY EQUIPMENT AND SUPPLIES


Data sourced from SAM.gov. View Official Posting »

Automatic Wire Bonder

Total Small Business Set-Aside (FAR 19.5)
Notice ID:1333ND26QNB030043

As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses

Department/Ind.Agency Subtier Office
COMMERCE, DEPARTMENT OF NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY DEPT OF COMMERCE NIST
NAICS 333242 - Semiconductor Machinery Manufacturing
  PSC   LABORATORY EQUIPMENT AND SUPPLIES


Data sourced from SAM.gov. View Official Posting »

Automatic Wire Bonder

Total Small Business Set-Aside (FAR 19.5)
Notice ID:1333ND26QNB030043

As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses

Department/Ind.Agency Subtier Office
COMMERCE, DEPARTMENT OF NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY DEPT OF COMMERCE NIST
NAICS 333242 - Semiconductor Machinery Manufacturing
  PSC   LABORATORY EQUIPMENT AND SUPPLIES


Data sourced from SAM.gov. View Official Posting »

Notification