CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Notice ID:1333ND26QNB030031

This opportunity is for an analytical instrument to be installed in a general purpose lab at the NIST advanced measurement laboratory facility. The instrument must fit within a specified footprint, with additional lab space available for service access and support equipment. The system must accommodate a variety of sample types, including full wafers, coupons, and packaged devices, and must include five compatible sample carriers. The required response date has been extended to March 9, 2026.

Department/Ind.Agency Subtier Office
COMMERCE, DEPARTMENT OF NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY DEPT OF COMMERCE NIST
  PSC   LABORATORY EQUIPMENT AND SUPPLIES


Data sourced from SAM.gov. View Official Posting »

CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Notice ID:1333ND26QNB030031

See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.

Department/Ind.Agency Subtier Office
COMMERCE, DEPARTMENT OF NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY DEPT OF COMMERCE NIST
  PSC   LABORATORY EQUIPMENT AND SUPPLIES


Data sourced from SAM.gov. View Official Posting »