CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
This opportunity is for an analytical instrument to be installed in a general purpose lab at the NIST advanced measurement laboratory facility. The instrument must fit within a specified footprint, with additional lab space available for service access and support equipment. The system must accommodate a variety of sample types, including full wafers, coupons, and packaged devices, and must include five compatible sample carriers. The required response date has been extended to March 9, 2026.