Inactive

Amendment #2 - The purpose of this amendment is to accomplish the following: 1. Upload the attachment that provides responses to the solicitation questions received. 2. Upload a revised solicitation d... Amendment #2 - The purpose of this amendment is to accomplish the following: 1. Upload the attachment that provides responses to the solicitation questions received. 2. Upload a revised solicitation document SF1449, that supersedes all previous versions. This document was revised based on responses to solicitation questions as noted in the document. 3. To notify interested offerors of a Pre-Proposal Conference that will be held on January 30, 2023 from 3:00 p.m. - 4:00 p.m. The conference is accesible via Microsoft Teams by the following methods: Microsoft Teams meeting Join on your computer, mobile app or room device Click here to join the meeting Meeting ID: 248 615 393 17 Passcode: TTWHib Download Teams | Join on the web Or call in (audio only) +1 443-339-4347,,532589791# United States, Baltimore Phone Conference ID: 532 589 791# Pre-Proposal Conference Agenda: Introduction of Government Personnel (~ 5 minutes) Background of CHIPS and the specific programmatic legal support services requirement (~ 10-15 minutes ) Review of Solicitation Instructions/Evaluation (~10-15 minutes ) Brief session for clarifying questions to the responses provided to the original solicitation questions posted in the attachments only. (Please Note: No responses are binding on the Government unless/until it is amended in the solicitation) (~ Approximately 15 minutes) Closing Amendment #1 - The purpose of this amendment is to accomplish the following: 1. Revise the solicitation to correct all references to Attachment #5, and change them to Attachment #4. 2. Upload the pricing templates which are labeled as Attachment 1 and 5. Sections 9902 and 9906 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (NDAA) authorized semiconductor manufacturing and research and development activities (the CHIPS Program). The CHIPS Act of 2022 enhanced the CHIPS program with new authorities and appropriated $50 billion to the Department of Commerce (the Department) to implement it. Section 9902 of the 2021 NDAA authorizes the Department to provide funding to eligible applicants to incentivize investment in facilities and equipment in the United States for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment. The Department may provide funding in various forms, including grants, cooperative agreements, loans, and loan guarantees. The CHIPS Act of 2022 appropriates $39 billion for these purposes. With these funds, the Department will establish an incentives program to support the expansion of manufacturing capacity for mature nodes and to attract large-scale investments in advanced technologies such as leading-edge logic and memory. Section 9906 of the 2021 NDAA authorizes the Department to establish a National Semiconductor Technology Center (NSTC) to conduct research and prototyping of advanced semiconductor technology and to establish a National Advanced Packaging Manufacturing Program led by the Director of the Department’s National Institute of Standards and Technology. Section 9906 also authorizes NIST to establish up to three Manufacturing USA institutes to advance research and commercialization of semiconductor manufacturing technologies, and to carry out an R&D program to advance measurement science, standards, material characterization, instrumentation, testing, and manufacturing capabilities. The CHIPS Act of 2022 appropriates $11 billion for these purposes. The Department’s Office of the General Counsel (OGC) has determined that it requires programmatic legal support services to advise and assist OGC on legal aspects of the CHIPS Program. See attached solicitation for specific details.