Inactive
Total Small Business Set-Aside (FAR 19.5)
Notice ID:1333ND23QNB680475
Amendment I: The purpose of this amendment is to address a technical question received regarding a requirement as follows: Question: Kindly advise the thickness for device layer? The thickness request...
Amendment I: The purpose of this amendment is to address a technical question received regarding a requirement as follows: Question: Kindly advise the thickness for device layer? The thickness requested is quite thick. Usually the maximum request is in the few hundreds micron range but the requested thickness was 20000 microns. Answer: There are no requirements for a thickness of 20,000 microns? Please see the NIST Requreiments attachment. It is a possiblility that the reader version that you are using has change the micro symbol to mm? As part of its effort in Single Photon-Single Electron devices, The National Institute of Standards and Technology (NIST), requires silicon-on-insulator (SOI) wafers with varying device layer thicknesses, to aid in back-etching for back illumination mode of operation. Plese see attachements for complete details.