Inactive
Total Small Business Set-Aside (FAR 19.5)
Notice ID:12805B19Q0013
Potato Grading System Solicitation #12805B19Q0013 NOTICE: This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Subpart 12.6, as supplemented with add...
Potato Grading System Solicitation #12805B19Q0013 NOTICE: This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued.to a combination of FAR Part 12, Acquisition of Commercial Items, and Part 13, Simplified Acquisition Procedures. This is a Small Business set-aside. 1. Read the solicitation in its entirety. 2. Quote submissions need to include any shipping costs. The quote should also include any other documentation deemed necessary. 3. Questions related to this RFQ are due via email by 10AM MST, August 5, 2019, to Jessica Massey at Jessica.Massey@usda.gov . 4. Quotes must be submitted via email by 2PM MST, August 7, 2019, to Jessica Massey at Jessica.Massey@usda.gov . 5. This is a Lowest Price Technically Acceptable Acquisition. Award of the contract resulting from this solicitation will be made to the lowest priced vendor that has been found to be technically acceptable. To be technically acceptable, vendor must meet all requirements for the potato grading system from Attachment I. NOTE: All contractors must be registered in the System for Award Management (SAM) database, as required by FAR 4.1102, by the quote submission deadline. Information on registration may be obtained by visiting https://sam.gov/SAM/. 6 . NAICS for this procurement is: 334419 - Other Electronic Component Manufacturing 750 Employees 7. Period of Performance: 8/9/2019 - 10/11/2019 8. Deliver To: USDA-ARS Potato Research Worksite 311 5th Ave, NE East Grand Forks, MN 56721 Attachments: -- RFQ 12805B19Q0013 Package -- Attachment I- Background and Specifications
