Inactive

Wire bonder - automatic & manual Wirebond from a circuit defined on a substrate to PCB board. The substrate for the circuit will either be Si or Sapphire with typical size in millimeter to centimeter.... Wire bonder - automatic & manual Wirebond from a circuit defined on a substrate to PCB board. The substrate for the circuit will either be Si or Sapphire with typical size in millimeter to centimeter. The circuit pads to bond could be Au, Al, Nb, or Ta with typical thickness of ~ 100 to 200 nm.